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ScribingMachine

 

 The fully-automatic 12-inch scribing machine developed bySAIS is integrated with multidisciplinary technology of precision machinery,electron, software, material, automatic control, photoelectricity, components,belongs to the filed of high and new technology, is widely applied to theindustry of IC, sensor, LED, solar energy battery substrate, medicalB-ultrasonic transducer head, optical component, NTC, etc., and is used for groovingand cutting hard and brittle material such as silicon wafer, glass, alumina,lithium niobate, gallium  arsenide,ferrite, etc. The machining dimension of the machine is increased to 12 inchfrom 8 inch, the machining speed is increased to 12 1000mm/s from 600mm/s, and the locating accuracy is increased to5μm/310mm from  5μm/210mm.The technical indexes fully meet advanced world standard, thereby effectivelyincreasing the technical level, innovation capability, industrializationcapability of domestic IC equipment.

  BTZ-3000 automatic probe stationadopts  integral box-type structure andclosed design. The body of the automatic probe station is mainly divided intofour parts-electrical control system, mechanical movement system,  operating system, and display system.  

  The equipment is a high-speedhigh-precision high-voltage probe station, is mainly applied to high voltagetest of semiconductor discrete components, photoelectric elements, is capable of shading test, and has the MAPdisplay function.  After being connectedwith a tester, the equipment can automatically test the electrical parameterand function of various transistor cores. The equipment is a production equipment which is designed specially forsemiconductor manufacturing plant and is be used for wafer test beforepackaging semiconductor chip. The equipment forms a set of complete test system together withcorresponding tester by performing signal communication.  

       

For more productinformation, please visit: Qinhuangdao Audio-Visual Machinery ResearchInstitute

Vacuum Electrostatic Sealer

acuum or atmosphere condition, is completes the monolayer orsandwich type static sealing of silicon-glass, glass-silicon-glass under theaction of temperature and electric field by applying a floating pressure,achieves the stress-free bonding between silicon chip and glass, meetings therequirement of MSMS technology to stress-free sealing, and meets therequirement of all static sealing less than 4 inch in the MEMS technology.PLC+PID intelligent control.


For more productinformation, please visit: Force Sensor Center

Vacuum Electrostatic Sealer

 Under the vacuum or atmosphere condition, is completes the monolayer or sandwich type static sealing of silicon-glass, glass-silicon-glass under the action of temperature and electric field by applying a floating pressure, achieves the stress-free bonding between silicon chip and glass, meetings the requirement of MSMS technology to stress-free sealing, and meets the requirement of all static sealing less than 4 inch in the MEMS technology. PLC+PID intelligent control.


For more productinformation, please visit:Force Sensor Center